Hoʻohana ka TRESKY soldering i ka mahu waikawa formic i hui pū ʻia me ka nitrogen (HCOOH + N2), kahi e hāʻawi ai i nā pono i ka optoelectronics a me ka photonics assembly a me nā ʻenehana interconnect. Hoʻemi pono ka waikawa formic i nā oxides a hoʻopau loa i ka flux. ʻO ka hoʻohana ʻana i ka waikawa formic e hōʻoiaʻiʻo pū i ka wettability maikaʻi o ka ʻili, e hana ana i nā kūlana kūpono no nā kaʻina hana hoʻoheheʻe paʻakikī. Hoʻohana ʻia kēia module no ka eutectic soldering a me ka thermocompression welding, no ka laʻana me indium. Hoʻohana nā kaʻina hana hoʻopaʻa āpau i ka waikawa formic i hoʻonui ʻia i ka nitrogen (HCOOH) me ka hoʻohana ʻana i kahi mea i kapa ʻia ʻo bubbler. Hoʻokomo ʻia kahi hui ʻana o ka mahu nitrogen a me ka waikawa formic i loko o ke keʻena lapaʻau ma ke ʻano i kāohi ʻia a unuhi ʻia.